ChipletsSmall chip packaging (also called chiplets in translation) technology is a hot topic in recent years, and will be differentIPModules are packaged together to further improve chip performance, previouslyAMDandIntelThe company also formedUCIeIndustry alliance, and now VeriSilicon has also joined the alliance, becoming the first domestic chip manufacturer to join.
VeriSilicon is a leading chip maker in ChinaIPService provider, the company announced a few days ago that it officially joinedUCIeindustry alliance.
As the first batch of enterprises in mainland China to join the organization, VeriSilicon will cooperate withUCIeOther members of the industry alliance work togetherUCIe 1.0Version Specifications and New GenerationsUCIeResearch and application of technical standards for VeriSiliconchipletThe development of technology and products further consolidates the foundation.
This year3moon,UCIe (Universal Chiplet Interconnect Express)The industry alliance consists of ASE,AMD、ARM、Google Cloud、IntelMicrosoft, Qualcomm, Samsung and TSMC ten companies were formally established, and the members of the alliance will work together to promotechipletstandardization of interface specifications and has been introducedUCIe 1.0version specification.
UCIeis an openchipletinterconnect specification, which defines the package within thechipletinterconnection between thechipletpervasive interconnection at the package level and openchipletecosystem.
The standard aims to create a new open standard for chiplet interconnection, simplifying related processes, and improving interoperability between chiplets from different manufacturers.
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