This year’s P-series flagship has been postponed for a long time in the past. The news broke that it had undergone a major product adjustment halfway through. Although the details involved are unknown, it can also be felt that the Huawei mobile phone team is not easy under the “sanctions.”
On the short video platform a few days ago, Weifeng Century, a mobile phone repair organization from Shanxi, disassembled the newly listed P50 Pro, and found the three-layer stacking design used in the CPU part.
We know that the mobile phone SoC and RAM running memory chips are usually stacked and packaged, that is, two layers. The maintenance organization found thatThe RAM chip used by the P50 Pro is a circle smaller than that of the Huawei Mate 40 Pro.Huawei’s approach is to directly add a transfer layer to Kirin 9000 and RAM, thereby changing it to the pin of Snapdragon 888 dedicated memory.。
The maintenance organization speculated that it might be because Huawei could not buy the dedicated memory of the Kirin 9000, so it adopted the above method.
Of course, this is just speculation. There are also opinions that perhaps the Snapdragon solution was not considered at the beginning of the P50 design. In the later stage, in order to reduce the cost of the two SoC solutions, the switch layer was used to realize a RAM chip with only one type of pin.
The agency tried to find that after removing the adapter layer, the Kirin 9000 RAM chip on the Huawei Mate 40 Pro was finally successfully installed on the P50 Pro.
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#Disassemble#Huawei P50 Pro
Editor in charge: Wan Nan