Yesterday, Intel announced a new CPU process roadmap, the 7, 4, 3, 20A, 18A process and various packaging technologies appeared in turn. It also announced that it would provide foundry services for Amazon and Qualcomm.
Intel also admitted that it lost to TSMC and Samsung at this stage, but claimed that it would produce the world‘s most advanced chip (20A) in 2024 and regain its leading position in semiconductor technology (18A) in 2025.
But just one day later,Relevant authorities in Taiwan, China formally approved TSMC’s plan to build a new 2nm plant in Baoshan Town, Hsinchu.
TSMC said: “I am very pleased that this project has been approved by the regulatory authorities and will continue to commit to green manufacturing.”
It is reported that,TSMC’s 2nm process will be a truly new design, which is known as the biggest leap in history. The biggest feature is that it will introduce nanosheet transistors for the first time to replace the current FinFET structure., Can better control the threshold voltage (Vt), the fluctuation is reduced by at least 15%, which will greatly improve the chip design and performance.
TSMC’s 2nm process is expected to be trial production in 2023 and mass production in 2024.
The process technology of different factories is now completely incomparable, but to some extent, Intel 20A/18A and TSMC 2nm should be similar.
In other words, Intel just said that it will return to its peak in three or four years, and TSMC is sure that it will come up with its own killer at least a year before that.
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