(Picture/Official website)
The Android camp has ushered in good news. In recent years, due to the overheating and power consumption of Qualcomm chips, the gap between the flagship model and the iPhone experience has been widened. In the second half of the year, with the two major chips operated by TSMC, consumers are expected to buy more affordable models. .
The first is the Snapdragon 8 Plus Gen 1 released by Qualcomm in May. It will be equipped with a variety of flagship mobile phones in the second half of the year. It has changed from Samsung to TSMC in the past, which greatly improves the efficiency of the chip, including CPU and GPU. 30% The overall power consumption has dropped by 15%, and Qualcomm claims that it can increase the game time by an hour.
Although the actual model has not yet been launched, there has been a lot of good news. For example, the whistleblower Ice Universe pointed out that the power consumption of Qualcomm Snapdragon 8 Plus Gen 1 is excellent. , which may be worth the expectation of users.
On the other hand, MediaTek, which originally cooperated with TSMC, has recently launched more and more mobile phones using high-end Dimensity chips in Taiwan. In addition, this week, it released the “Dimensity 9000+”, which is the latest generation of flagship products. Mainly improve the running clock of the large core Cortex-X2, from 3.05GHz to 3.2GHz, the CPU can bring 5% upgrade, and the GPU has 10%.
ASUS ROG Phone 6 will be officially announced on July 5, and is expected to be Taiwan’s first flagship phone using Qualcomm’s Snapdragon 8 Plus Gen 1 chip. As for the Dimensity 9000+, related phones will be launched in the third quarter.
“You Might Want to Watch”
Taiwan’s 5 major telecom “Internet Speed Rankings” released!The two leading companies have the most obvious advantages
No need to draw, no need to grab, now use the APP to watch the news to ensure that you win the prize every day, I download the APP and press me to watch the event method