Ten years ago, in 2011, Intel first released the FinFET process. The 22nm FinFET process was far ahead of TSMC and Samsung’s 28nm at that time, and its technological advantage was at least three and a half years ahead of friends (Intel’s previous official statement). However, after the 14nm node, Intel fell behind .
From 2014 to 2021, Intel’s mainstream CPU technology is 14nm, and the three generations of 14nm, 14nm+ and 14nm++ have been polished, creating the myth of 8-core 5GHz processors, and the performance is still very powerful.
However, in the past 10 years, TSMC has seized the opportunity of mobile processors, and the process has been upgraded to the current 7nm and 5nm. Even if the technical level is considered to be watery, TSMC has become the king of chip manufacturing.
If you understand this background, then Intel’s new generation CPU process roadmap announced today will be better understood. The new CEO Kissinger who took office in March is an Intel veteran with more than 30 years of experience and has witnessed the most glorious era of Intel’s technology. , Now he wants to regroup.
Of course, this reform has one thing that surprised netizens, that is, Intel is really like the previous jokes of netizens.I played a game that renamed the process. At the end of the year, the 10nm ESF process was renamed to Intel 7, and the planned 7nm was renamed to Intel 4. In the future, the Intel 3 process will continue to be launched. This rename will directly involve Intel and TSMC. Standing on the same starting line, after all, TSMC’s mass production in 2023 is also the 3nm process, which is also the last generation of FinFET process.
The ridicule belongs to the ridicule, but the process that Intel launched this time is not only as simple as renaming, one thing is very worthy of attentionThat is, Intel will take the lead from the nano-era into the Ami era (Ångstrom, 1 nanometer is equal to 10 A-meters). This is the Intel 20A process that Intel is expected to launch in 2024. The A refers to A-meters.
In the Amy era, the 20A process has two revolutionary new technologies, RibbonFET and PowerVia. The former is similar to Samsung’s GAA surround gate transistor. PoerVia is the first to cancel the power supply trace on the front side of the wafer and switch to the rear power supply. Optimize signal transmission.
The specific details of the 20A process have not yet been announced, but in a literal sense, 20A is almost at the level of the 2nm process, which is in line with the progress of Moore’s Law after 3nm.
After the 20A process, there is the 18A process,In addition to continuing to improve RibbonFET and PowerVia technologies, Intel is expected to launch the next-generation EUV lithography machine with NA 0.55 for the first time.
If Intel’s goal is explained in one sentence, it is the statement of CEO Kissinger in a media interview a few days ago-Between 2024 and 2025, Intel will return to its leading position in semiconductor technology.The unspoken implication is to surpass Samsung and TSMC, while ensuring the unshakable position of the United States in semiconductor technology.
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