Frore Systems Launches AirJet Mini Slim for Improved Heat Dissipation
Frore Systems has unveiled the highly anticipated AirJet Mini Slim, a cooling module designed to bring better heat dissipation to various thin and light devices. The new design aims to reduce noise, dust accumulation, and other common problems associated with traditional fans.
The AirJet Mini Slim is a thinner and lighter version of the AirJet Mini, which was first exhibited at Computex 2023 in collaboration with Zotac. According to Frore Systems, the new design offers a more significant cooling effect than traditional fans, while maintaining the same heat dissipation performance.
Measuring at only 2.5mm thick and weighing just 8 grams, the AirJet Mini Slim is designed to be thinner and lighter than its predecessor. It utilizes electricity to drive the vibration of the internal membrane, generating a wind speed of 200 meters per second to effectively drive away heat around the chip.
One of the key features of the AirJet Mini Slim is its ability to be used in various thin and light laptops, small PCs, fanless mobile phones, tablets, IoT devices, automotive platform devices, and more. It also includes a thermal sensing function, automatically improving heat dissipation efficiency when the detected temperature becomes significantly higher.
In addition, the AirJet Mini Slim boasts an automatic cleaning function to prevent dust accumulation after long-term use, ensuring the module maintains its normal cooling effects. It can also be expanded to multiple groups, with a single chip capable of removing approximately 5W of heat energy.
The launch of the AirJet Mini Slim follows the release of the first AirJet cooling module in January of last year and the introduction of the AirJet Mini at Computex 2023. With its advanced technology and improved performance, the AirJet Mini Slim is expected to make a significant impact in the industry of heat dissipation for thin and light devices.