Source: Aijiwei
#TSMC#
#Japan#
#3D IC#
#Advanced packaging#
12 hours ago
According to Taiwan media reports, TSMC announced today that its subsidiary TSMC Japan 3D IC R&D Center has completed the clean room project at the Tsukuba Center of the Japan Institute of Industrial Technology and held an opening ceremony today.
Wei Zhejia, President of TSMC, said that TSMC was founded with a professional integrated circuit manufacturing service business model. It is in the semiconductor field and firmly believes that by focusing on what it is best at, TSMC can make the greatest contribution to promoting technological progress. Japan’s 3D IC R&D Center is exactly that. The perfect embodiment of this cooperative model.
Wei Zhejia said that the cooperation between TSMC and Japanese industrial talents will be able to empower each other and achieve breakthroughs together.
Liao Dedui, deputy general manager of TSMC’s advanced packaging technology and services, said that today a single chip contains about tens of billions of transistors. With advanced packaging technology and three-dimensional integrated circuit technology, TSMC can package hundreds of billions of transistors, providing new computing power.
Liao Dedui said that TSMC will work with partners at Japan’s 3D IC R&D Center to jointly develop technologies that will help make innovations concrete.
Emoto Yu, director of TSMC Japan’s 3D IC R&D Center, said that the industry trend from 5G and high-performance computing-related applications drives the structural demand for semiconductors, and further technological innovation is needed to meet this demand. (Proofreading/Value)
Editor in charge: Qingquan