Home » Mi Yujie: There is still room for development of processes below 2 nanometers, and cooperation between TSMC and customers is the key | TechNews Technology News

Mi Yujie: There is still room for development of processes below 2 nanometers, and cooperation between TSMC and customers is the key | TechNews Technology News

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Mi Yujie: There is still room for development of processes below 2 nanometers, and cooperation between TSMC and customers is the key | TechNews Technology News

TSMC’s Co-CEO Discusses Future of Advanced Process Development in Exclusive Interview with AMD

In a recent exclusive interview with AMD’s Chief Technology Officer Mark Papermaster, TSMC’s co-chief operating officer Mi Yujie shared insights into the future of advanced process development. Mi Yujie highlighted the ongoing evolution of advanced manufacturing and emphasized the importance of collaboration with customers in driving successful outcomes.

According to Mi Yujie, there is still room for development of processes below 2 nanometers, with a focus on introducing new technologies in each new generation of manufacturing. TSMC has adopted a dual R&D team system, allowing for a more structured approach to launching the latest process technology. Despite the longer development cycles of 5 to 7 years for each generation, TSMC remains committed to pushing the semiconductor industry forward.

Looking ahead, TSMC is exploring technologies such as silicon photonics, strengthening cooperation with DRAM memory manufacturers, and studying the introduction of 3D stacking into transistor-level structures. The company is set to introduce more complex GAA technology transistors at the 2nm node, with mass production scheduled for 2025.

During the interview, Mark Papermaster highlighted the shift towards a more collaborative approach between foundries and fabless IC design companies, emphasizing the importance of Design-Technology Co-Optimization (DTCO). Mi Yujie echoed this sentiment, noting that DTCO plays a crucial role in identifying valuable process technology development routes and optimizing chip design for improved performance, energy consumption, and chip area.

Mi Yujie also touched on the growing influence of artificial intelligence in the high-performance computing (HPC) industry, predicting a prosperous future for the sector fueled by advancements in AI technology. As the HPC industry continues to evolve, it is expected to surpass the PC and smartphone industries in terms of growth and innovation.

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Overall, the interview shed light on TSMC’s commitment to driving innovation in advanced process development and the importance of collaboration and technology optimization in achieving successful outcomes in the semiconductor industry.

(Source: Science and Technology News)

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